The USB3300 is an industrial temperature Hi-Speed USB Physical Layer Transceiver (PHY). The USB3300 uses a low pin count interface (ULPI) to connect to a ULPI compliant Link layer. The ULPI interface reduces the UTMI+ interface from 54 pins to 12 pins using a method of in-band signaling and status byte transfers between the Link and PHY.

This PHY was designed from the start with the ULPI interface. No UTMI to ULPI wrappers are used in this design which provides a seamless ULPI to Link interface. The result is a PHY with a low latency transmit and receive time. Microchip's low latency high speed and full speed receiver provide the option of re-using existing UTMI Links with a simple wrapper to convert UTMI to ULPI.

The ULPI interface allows the USB3300 PHY to operate as a device, host, or an On-The-Go (OTG) device. Designs using the USB3300 PHY as a device, can add host and OTG capability at a later date with no additional pins.

The ULPI interface, combined with Microchip's proprietary technology, makes the USB3300 the ideal method of adding Hi-Speed USB to new designs. The USB3300 features an industry leading small footprint package (5mm by 5mm) with sub 1mm height. In addition the USB3300 integrates all DP and DM termination resistances and requires a minimal number of external components.

Microchip's complimentary and confidential MicroCHECK design review service, which offers insight from the initial concept to the final PCB layout, is available to customers who are using our products in their projects. You can confidently submit your design materials in a secure and private setting, and our expert engineers will provide individualized feedback to enhance your design. MicroCHECK design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.