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Highly-Integrated Hybrid Power Modules
Hybrid Power Drive (HPD) modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. These configurable power devices include a three-bridge topology that is available in Silicon Carbide (SiC) or Silicon (Si) semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of More Electric Aircraft (MEA).
The HPD module is a cost-effective unit that integrates a power bridge and a driver stage. You can use HPD modules in power conversion applications for electric motor drives on aircraft flight-critical actuator systems.
Featured Product
Three-Phase Bridge, Brake, Soft Start and Solenoid Power Module
This Hybrid Power Device (HPD) is a complete solution that offers excellent performance, reliability and reduced weight. This module comes with an AlSiC baseplate with maximum dimensions of 108 mm × 67 mm × 25 mm.
Applications
- HPD for Electromechanical Actuator (EMA) and Electrohydrostatic Actuator (EHA) systems
- High-reliability Power Core Module (PCM)
- Modular power module for Power Drive Electronics (PDEs)
Key Benefits
Enhanced Power Efficiency
The high-performance SiC technology allows for higher power density, which means more power can be handled in a smaller footprint. Additionally, SiC technology significantly reduces switching losses, enhancing overall system efficiency and enabling faster switching speeds.
Consistent Performance
Stability is crucial for maintaining consistent performance in demanding environments. The ability to operate reliably at high temperatures without performance degradation extends the lifespan of the devices and reduces the need for additional cooling mechanisms.
Eco-Friendly Packaging
Environmentally friendly and mechanically robust packaging ensures that the SiC devices can withstand harsh environmental conditions, including mechanical shocks and vibrations.
Simplified Assembly
Solderable terminals simplify the process of mounting onto printed circuit boards (PCBs). This feature reduces assembly time and costs, making it easier for manufacturers to integrate these high-performance components into their designs. The solderable terminals also ensure a secure and reliable electrical connection, which is critical for maintaining the integrity of the overall system.
Optimized Cooling
High thermal conductivity and low junction-to-case thermal resistance allow for efficient heat dissipation. The ability to directly mount these devices to a heatsink further enhances their thermal management capabilities. This reduces the need for extensive cooling systems, lowering overall system costs and improving reliability.
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