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As subsystem designs get more complicated and board space becomes more valuable, many designers are considering using Silicon (Si) or Silicon Carbide (SiC) based power modules instead of traditional discrete DC-DC Point-of-Load (POL) designs to reduce board size, improve reliability and performance and speed up time to market.
Our highly integrated power modules contain a controller, power switches and the necessary passive components—all of which are fully tested and pre-characterized for EMI and DC performance—to offer a complete switching power supply solution.
We offer a wide range of high-quality modules optimized for reliability, efficiency and electrical performance, cost and space savings and reduced assembly time.
Module product line spans a wide selection of semiconductor (including Silicon Carbide circuit topologies, voltage and current ratings and packages.
Our family of baseplate-less power modules is engineered to reduce weight by up to 40% and add substantial price improvements over traditional metal base plate modules. When used with our broad portfolio of Silicon Carbide (SiC) semiconductor technology solutions, these baseplate-less power modules provide significant efficiency advantages while meeting all the mechanical and environmental compliance guidelines for airborne equipment.
Our Hybrid Power Drive (HPD) module is a cost-effective unit integrating a power bridge and a driver stage. Its output power rating starts at 5 kVA. The standard substrate design is composed of a three-phase inverter bridge circuit implemented with SiC Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) and SiC Schottky Barrier Diodes (SBDs).
Our cost-effective, plug-and-play Integrated Actuation Power Solution combines a Hybrid Power Drive (HPD) and a compatible driver board that provides intelligence, scalability, design flexibility, reliability, faster time to market and high power density for aircraft power system applications in More Electric Aircraft (MEA), cargo planes, small planes, defense avionics, electric Vertical Takeoff and Landing (eVTOL) aircraft, drones and multicopters.
The new seventh generation of IGBT power modules is now available in seven packages across 49 parts. These devices feature lower VCE(sat) and Vf, overload capacity at Tj 175°C, 50% higher current capability, enhanced controllability of dv/dt, improved freewheeling diode softness and simpler driving compared to previous legacy generations. These features offer a differentiated value proposition of high power density, durability, reduced system costs, higher efficiency, ease of use and faster time to market.
Provides design suggestions for common circuit needs, estimates performance for common modifications, and can export to MPLAB® Mindi™ Analog Simulator for verification
Uses a SIMetrix/SIMPLIS environment to model circuit behavior, reducing design time with software debugging for initial design verification
Provides advice on your exact physical circuit layout, sharing best practices from an experienced power supply designer so that physical hardware will match simulations