• Higher power density to maximize the use of physical space within the data center
• Power supplies designed to handle high power loads without occupying excessive space
• Innovative packaging techniques

• Efficient power conversion for reducing energy losses
• Reduced waste heat because of efficient power conversion
• Reduced requirement for extensive cooling

• EMI can interfere with the operation of sensitive electronic equipment
• Servers and networking equipment are susceptible to EMI, which can impact their reliability and efficiency
• Power supplies, especially switch-mode power supplies (SMPS), operate by rapidly switching on and off. This switching action generates high-frequency transients that can radiate EMI

Power Density:

• Integrates high-side and low-side MOSFETs, which reduces the need for external components
• Thermally efficient package, such as the 3 × 3 mm DFN package
• Requires smaller inductors and capacitors

Efficiency:

• Synchronous four-switch buck/boost architecture
• Integrated MOSFET drivers and linear regulators
• Replaces the traditional diode with a low-resistance MOSFET
• Thermal management features, including thermal shutdown protection
• Low quiescent current

EMI/EMC:

• Fixed switching frequency, which helps in predicting and managing the EMI spectrum
• Optimized layout and pin configuration
• Easy addition of external filters and shielding if necessary

Power Density:

• Integrates high-side and low-side MOSFETs, which reduces the need for external components
• Includes optimized layout and thermal pad connections

Efficiency:

• Low-Dropout (LDO) voltage
• High Power Supply Rejection Ratio (PSRR)
• Accurate voltage regulation to optimize the performance of the load and reduce power wastage

EMI/EMC:

• Low noise output to minimize EMI
• Integrated bypass capacitors
• Thermal shutdown and current limit protection

Power Density:

• Integrated FETs and gate drivers
• Compact package size for space-constrained applications

Efficiency:

• Advanced control features such as adaptive on-time control, which improves transient response and stability
• Synchronous rectification to the traditional diode with a low-resistance MOSFET

EMI/EMC:

• Thermal shutdown protection
• Spread spectrum modulation, which dithers the switching frequency slightly

Power Density:

• Integrates high-side and low-side MOSFETs, which reduces the need for external components
• Reducing the overall size of the power supply solution

Efficiency:

• Advanced control features such as programmable current limit, soft-start and frequency synchronization
• Synchronous rectification to the traditional diode with a low-resistance MOSFET
• Low quiescent current

EMI/EMC:

• Spread spectrum modulation, which dithers the switching frequency slightly
• Features a programmable soft-start to control the in-rush current and reduce EMI during startup

Power Density:

• Requires smaller inductors and capacitors
• Includes integrated MOSFET drivers 

Efficiency:

• Synchronous rectification improves efficiency by reducing power losses associated with diode rectification
• Less heat generation and potentially smaller heat dissipation components

EMI/EMC:

• Reduced peak electromagnetic emissions by spreading the energy over a wider frequency band
• Optimized layout and filtering
• Controlled switching characteristics, including adjustable switching frequency and soft-start functionality

Power Density:

• Requires smaller inductors and capacitors
• Includes integrated MOSFET drivers 

Efficiency:

• Synchronous rectification that improves efficiency by reducing power losses associated with diode rectification
• Less heat generation and potentially smaller heat dissipation components 

EMI/EMC:

• Reduced peak electromagnetic emissions by spreading the energy over a wider frequency band
• Optimized layout and filtering
• Controlled switching characteristics, including adjustable switching frequency and soft-start functionality

Power Density:

• Comes in a small, thermally enhanced package
• Includes high-side and low-side MOSFETs, which reduces the need for external components
• Requires smaller inductors and capacitors

Efficiency:

• Low quiescent current
• Integrated power MOSFETs
• Advanced control techniques
• Battery-powered applications where extending battery life is crucial
• Optimized layout and packaging to dissipate heat effectively

EMI/EMC:

• Built-in EMI filters that help suppress high-frequency noise 
• Controlled rise and fall times
• Low output capacitance
• Optimized PCB layout recommendations

Power Density:

• Comes in a small, thermally enhanced package
• Includes high-side and low-side MOSFETs, which reduces the need for external components
• Requires smaller inductors and capacitors

Efficiency:

• Low quiescent current
• Integrated power MOSFETs
• Advanced control techniques
• Battery-powered applications where extending battery life is crucial
• Optimized layout and packaging to dissipate heat effectively

EMI/EMC:

• Built-in EMI filters that help suppress high-frequency noise 
• Controlled rise and fall times
• Low output capacitance
• Optimized PCB layout recommendations