SmartFusion2 Advanced Development Kit

SmartFusion®2 Advanced Development Kit offers a full-featured 150K LE device SmartFusion2 system-on-chip (SoC) FPGA. This 150K LE device inherently integrates reliable flash-based FPGA fabric, a 166 MHz Cortex™-M3 processor, advanced data security features, digital signal processing (DSP) blocks, static random-access memory (SRAM), embedded non-volatile memory (eNVM), and industry-required high-performance communication interfaces—all on a single chip. This device also supports all the data security features available in SmartFusion2 devices.
The Advanced Development Kit board has numerous standard and advanced peripherals such as PCIe®x4 edge connector, two FMC connectors for using many off the shelf daughter cards, USB, Philips inter-integrated circuit (I2C), two gigabit Ethernet ports, serial peripheral interface (SPI), and UART. A high precision operational amplifier circuitry on the board helps to measure core power consumption by the device.
The SmartFusion2 SoC FPGA memory management system is supported by 1 Giga Byte (GB) of onboard double data rate3 (DDR3) memory and 2 Giga Bit (Gb) SPI flash—1Gb connected to the Microcontroller Subsystem (MSS) and 1Gb connected to the FPGA fabric. The serializer and deserializer (SERDES) blocks can be accessed through the peripheral component interconnect express (PCIe) edge connector or high-speed subminiature push-on (SMA) connectors or through on-board FPGA mezzanine card (FMC) connector.
Kit has programming hardware implemented onboard and does not need an external FlashPro hardware for programming.

Kit Capabilities

• Microprocessor applications
• Embedded ARM® Cortex™-M3 processor-based systems
• Motor control
• Industrial automation
• Power measurement
• Security applications
• FMC expansion
• High speed I/O applications
• Universal serial bus (USB) applications (OTG support)