Title |
Title
USB333x Transceiver Layout Guidelines
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Name |
Name
AN204
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Date |
Date
03/10/2019
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Description |
Description
This application note provides general PCB layout guidelines for the USB333x family of devices to enable the design of functionally robust and reliable products which utilize the 480 Mbps USB 2.0 interface. Excellent signal integrity is required to operate reliably at high-speed data rates, so care must be taken designing the PCB to support this interface. The USB333x is offered in a 25 ball Wafer-Level Chip-Scale Package (WLCSP, 1.95 mm X 1.95 mm, 0.4mm pitch), and this requires special attention to insure a robust and reliable connection.
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