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Have your custom products outgrown the university environment, or do you require a level of customization at lower volumes that is not always supported in pure-play semiconductor foundries? Our team of experienced process engineers can help you manufacture your custom projects on 150 or 200 mm wafer diameters at one of our three IATF-16949 certified wafer fabs located in the United States. We offer core competencies in the following areas:
- CMOS
- Bipolar-CMOS-DMOS (BCD)
- Embedded Nonvolatile Memory (eNVM)
- Silicon-on-Insulator (SOI) high-voltage technologies
- Charge Coupled Devices (CCDs)
- Micro-Electrical Mechanical Systems (MEMS)
To learn more about how our wafer foundry services can meet your specific requirements, please contact foundryservices@microchip.com.
Full and Semi-Custom Processes
- Transfer your existing process from another fab or university
- Create a custom process using our vast catalog of standard process modules
CCDs
- Standard process flows available at various nodes that can be tailored to your specifications
- I-line lithography with stitching option available for large sensors
MEMS
- Thin wafer handling
- Specialized equipment including: DRIE, backside processing with frontside alignment, wafer bonder, 1X aligner, KOH etch and CPD
Unit Processes
- Epitaxial silicon growth
- Ion implant
- Species available: B, P, As, Sb
- Wide range of doses and energies available