ATSAMV70Q19 | Microchip Technology

Overview

  • Part Family:SAMV70
  • CPU Type:Cortex-M7
  • MaxSpeed (MHz):300
  • Program Memory Size (KB):512
  • SRAM (KB):256
  • Temp. Range Min.:-40
  • Temp. Range Max.:105
  • Operation Voltage Min.(V):1.7
  • Operation Voltage Max.(V):3.6
  • SPI:5
  • I2C:3
  • UART:8
  • QSPI:1
  • Crypto Engine:Yes
  • Internal Oscillator:4,8,12Mhz, 32Khz
  • Pin Count:144
  • Secure Boot:No
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  • ARM® Cortex®-M7 running up to 300MHz
  • 16 Kbytes of ICache and 16 Kbytes of DCache with Error Code Correction (ECC)
  • Single- and double-precision HW Floating Point Unit (FPU)
  • Memory Protection Unit (MPU) with 16 zones
  • DSP Instructions, Thumb®-2 Instruction Set
  • Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU)
  • 1024 Kbytes embedded Flash with unique identifier and user signature for user-defined data
  • 384 Kbytes embedded Multi-port SRAM
  • Tightly Coupled Memory (TCM) interface with four configurations (disabled, 2 x 32 Kbytes, 2 x 64 Kbytes, 2 x 128 Kbytes)
  • 16 Kbytes ROM with embedded Bootloader routines (UART0, USB) and IAP routines
  • 16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash with on-the-fly scrambling
  • Embedded voltage regulator for single-supply operation
  • Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation
  • Quartz or ceramic resonator oscillators: 3 to 20 MHz main oscillator with failure detection, 12 MHz or 16 MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock
  • RTC with Gregorian calendar mode, waveform generation in low-power modes
  • RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations
  • 32-bit low-power Real-time Timer (RTT)
  • High-precision Main RC oscillator with 12 MHz default frequency for device startup. In-application trimming access for frequency adjustment. 8/12 MHz are factory-trimmed.
  • 32.768 kHz crystal oscillator or Slow RC oscillator as source of low-power mode device clock (SLCK)
  • One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations
  • Temperature Sensor
  • One dual-port 24-channel central DMA Controller (XDMAC)
  • Low-power Sleep, Wait and Backup modes, with typical power consumption down to 1.1 µA in Backup mode with RTC, RTT and wakeup logic enabled
  • Ultra-low-power RTC and RTT
  • 1 Kbyte of backup RAM (BRAM) with dedicated regulator
  • USB 2.0 Device/Mini Host High-speed (USBHS) at 480 Mbps, 4-Kbyte FIFO, up to 10 bidirectional endpoints, dedicated DMA
  • 12-bit ITU-R BT. 601/656 Image Sensor Interface (ISI)
  • Two Host Controller Area Networks (MCAN) with Flexible Data Rate (CAN-FD) with SRAM-based mailboxes, time- and event-triggered transmission
  • MediaLB® device with 3-wire mode, up to 1024 x Fs speed, supporting MOST25 and MOST50 networks
  • Three USARTs. USART0/1/2 support LIN mode, ISO7816, IrDA®, RS-485, SPI, Manchester and Modem modes; USART1 supports LON mode.
  • Five 2-wire UARTs with SleepWalking™ support
  • Three Two-Wire Interfaces (TWIHS) (I2C-compatible) with SleepWalking™ support
  • Quad I/O Serial Peripheral Interface (QSPI) interfacing up to 256 MB Flash and with eXecute-In-Place and on-the-fly scrambling
  • Two Serial Peripheral Interfaces (SPI)
  • One Serial Synchronous Controller (SSC) with I2S and TDM support
  • Two Inter-IC Sound Controllers (I2SC)
  • One High-speed Multimedia Card Interface (HSMCI) (SDIO/SD Card/e.MMC)
  • Four Three-Channel 16-bit Timer/Counters (TC) with Capture, Waveform, Compare and PWM modes, constant on time. Quadrature decoder logic and 2-bit Gray Up/Down Counter for stepper motor
  • Two 4-channel 16-bit PWMs with complementary outputs, Dead Time Generator and eight fault inputs per PWM for motor control, two external triggers to manage power factor correction (PFC), DC-DC and lighting control.
  • Two Analog Front-End Controllers (AFEC), each supporting up to 12 channels with differential input mode and programmable gain stage, allowing dual sample-and-hold at up to 1.7 Msps. Offset and gain error correction feature.
  • One 2-channel 12-bit 1 Msps-per-channel Digital-to-Analog Controller (DAC) with Differential and Over Sampling modes
  • One Analog Comparator Controller (ACC) with flexible input selection, selectable input hysteresis
  • True Random Number Generator (TRNG)
  • AES: 256-, 192-, 128-bit Key Algorithm, Compliant with FIPS PUB-197 Specifications
  • Integrity Check Monitor (ICM). Supports Secure Hash Algorithm SHA1, SHA224 and SHA256.
  • Up to 114 I/O lines with external interrupt capability (edge- or level-sensitivity), debouncing, glitch filtering and On-die Series Resistor Termination
  • Five Parallel Input/output Controllers (PIO)
  • Single supply voltage from 3.0V to 3.6V
  • Qualification AEC-Q100 grade 2 ([-40°C : +105°C] ambient temperature)
  • LQFP100, 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm
  • TFBGA100, 100-ball TFBGA, 9 x 9 mm, pitch 0.8 mm
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