We detect you are using an unsupported browser. For the best experience, please visit the site using Chrome, Firefox, Safari, or Edge. X
Maximize Your Experience: Reap the Personalized Advantages by Completing Your Profile to Its Fullest. Update Here
Stay in the loop with the latest from Microchip. Update your profile while you are at it. Update Here
Complete your profile to access more resources. Update Here

Semiconductor Packaging Miniaturization Services

World-Class Miniaturized Electronic Packaging Services

As a leading provider of miniaturized electronic packaging solutions, we specialize in high-reliability packaged modules that can withstand harsh environments.

We manufacture advanced semiconductor packaging for a variety of end products. They are used in delicate and precise medical equipment such as pacemakers and ingestible cameras, as well as in surgical robots, power modules and high-speed optical communications. Our world-class, multi-skilled team will work with you to provide solutions that meet your product’s specific requirements.

We offer custom process development for your new design. We can take your design concept from prototype to volume production rapidly, saving you time and reducing costs while also future proofing your product for long-term supply. 

Advanced Packaging Capabilities

Secure the competitive advantage that we offer when you need high-precision and high-accuracy semiconductor solutions. Because we offer full microelectronic packaging services including design, substrate, assembly and test completely in house, there’s no need for you to invest in your own capital equipment. Here are some of our most popular services:

Substrate

  • Rigid FR
  • Flex-rigid
  • Embedding
  • LGA, BGA
  • Ceramic

Assembly

  • Wafer dicing
  • Die attach
  • Wire bond
  • Encapsulation
  • Flip chip
  • SMT
  • Serialization

Design

  • Specification
  • Schematic
  • Layout
  • Simulation—RF and power
  • Mechanical—thermal and stress

Test

  • Wafer probe
  • PCBA functional test
  • Socket design
  • Software development
  • Burn-in

Fully In-House Services

We specialize in designing, manufacturing, and testing complex semiconductors, which is done all in house. 

We currently manufacture two standard products to sell directly to customers. These are radio modules that are used in external controllers for implantable medical devices:

  • MiniSIM (ZL70323)
  • Base Station Module (ZL70123)

Markets Served

car

Automotive

Our automotive devices are supported by a variety of demonstration and evaluation kits, reference boards, software and detailed documentation to reduce your development time. 

skeleton

Medical

We manufacture modules for implantable devices. These leading-edge solutions are unrivaled in their small sizes and long product lifespans. We also manufacture base station modules that enable implants to communicate and transfer data effectively.

space

Space

With a decades-long track record for innovation, quality and reliability, we have played a pivotal role in a variety of space programs. 

Miniaturized Electronics for Smart Implants

The first generations of implants were life-transforming inventions that saved and improved the lives of millions of people. Microelectronics are revolutionizing implant technology, replacing mechanical solutions with small and smart devices that meet Size, Weight and Power (SWaP) requirements. These new smart implants offer higher component density, more functionality and extended operational life.

We are partnering with medical companies to develop implants that can provide real-time data to doctors and patients. Devices that offer real-time communication can provide unprecedented benefits to the medical industry.

Key Benefits

  • Smaller, lighter and more powerful products 
  • Consultant services
  • Focus on quality  
  • Confidentiality
  • Comprehensive system solutions
  • Supply chain management
  • Global support network 
Learn About Implantable Medical Solutions

Solving Customer Challenges

One of our customers struggled to find a Printed Circuit Board (PCB) assembly supplier that was able to support the specific needs for developing an implantable device. Their key requirements for their supplier were:

  • Full turnkey services
  • Proven experience to improve their product’s SWaP
  • Flexibility to manage their design iterations and take their project from low-volume prototypes to high-volume production
  • Very high product reliability, minimal risk and a reliable source of resources and components

We were able to offer this customer:

  • Highly flexible and agile processes
  • Timely delivery
  • Support for the highest quality standards, including ISO 9001 and IPC A 610
  • High-yield assemblies
  • A proven market leader
  • A consistent supply of components
  • One-on-one assistance
  • Frequent contact via weekly calls and daily emails
  • Consulting from our team

As a result of our collaboration, we were able to help this customer reduce size of their implantable product, which uses the ZL70103 RF transceiver, by 70%. 

Contact Us

Microchip Advanced Packaging Services
Phase 2, Castlegate Business Park, Unit 4, Caldicot
Monmouthshire, South Wales, UK
NP26 5YW

Email Address: Info-Caldicot@microchip.com
Phone Number: (+44) 01291 435351

Caldicot Microchip Advanced Packaging Services UK Location