If you’re interested in using one of our microprocessors (MPUs) but the more complex hardware design of these devices raises concerns, our Arm® processor-based System in Package (SiP) or System on Module (SOM) is your solution. Even developers with expertise in the design of an industrial-grade microprocessor (MPU)-based system spend a lot of time on PCB layout to guarantee signal integrity for the high-speed interfaces, DDR memories and Ethernet Physical Layers (PHYs) of MPUs while trying to comply with Electromagnetic Compatibility (EMC) standards.
System in Package
Key Benefits
- Simplifies PCB design
- TA100 Secure Element option
- 64 Mb to 4 Gb memory size options
- Smallest footprint
- Supports RTOS and Linux® OS
- Reduces your supplier list
System on Module
Key Benefits
- Low-cost assembly
- Mainlined Linux distribution
- Customer-driven obsolescence
- Qualified for production use
- Single power rail
SiPs integrate SDRAM, DDRx or LPDDRx memory and an MPU, removing the high-speed memory interface constraints from the PCB and reducing its size. Some of our SiPs include an optional TA100 secure element.
A SOM takes it a step further by integrating power management, an Ethernet PHY, nonvolatile boot memory and an optional wireless module on a small PCB. A SOM offers single-supply and standard surface-mount manufacturing technology, similar to a QFP package, and can even be hand soldered during initial prototyping.
SOM products are supported by our MPLAB® Harmony development tools for bare metal, RTOS-based embedded systems and the Linux® OS environment.