MCP2003B | Microchip Technology

Overview

  • Baud Rate Max [kbit/s]:20
  • TempRange [°C] Max:150
  • Vin Max (V):30
  • Vin Min (V):6
  • Wake Pin:Yes
  • Watchdog:No
  • Wettable Flanks:No
  • Integrated VREG:No
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  • The MCP2003B is Compliant with Local Interconnect Network (LIN) Bus Specifications 1.3, 2.0, 2.1, 2.2, SAE J2602, and ISO17987
  • Supports Baud Rates up to 20 Kbaud with LIN-Compatible Output Driver
  • 60V Load Dump Protected
  • Very High Electromagnetic Immunity (EMI) Meets Stringent Original Equipment Manufacturers (OEM) Requirements
  • ±35V on LBUS (SAE J2962-1)
  • ±85V on LBUS (SAE J2962-1)
  • >25kV on LBUS (SAE J2962-1)
  • >15kV on VBB (IEC 61000-4-2)
  • >6 kV on LBUS (IEC 61000-4-2)
  • Very High Immunity to RF Disturbances Meets Stringent OEM Requirements
  • Wide Supply Voltage: 5.5V – 30.0V Continuous
  • Extended (E) Temperature Range: -40°C to +125°C
  • High (H) Temperature Range: -40°C to +150°C
  • Interfaces to PIC® MCU EUSART and Standard USARTs
  • Internal pull-up resistor and diode
  • Protected against battery shorts
  • Protected against loss of ground
  • High current drive: >40 mA
  • Automatic Thermal Shutdown
  • Low-Power Mode (~ 5 μA)
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MCP2003B
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