Product Change Notification: JAON-22WRZE808
PCN
Status:
Final notification
Microchip
Parts Affected:
See attachments of affected catalog part
numbers (CPN) labeled as…
PCN_JAON-22WRZE808_Affected_CPN.xls
PCN_JAON-22WRZE808_Affected_CPN.pdf
Description
of Change:
Qualification
of G700LTD Mold Compound and 8600 Die Attach in various QFN packages using
EFTC64T LF at NSEB (UTL).
Pre Change:
G770HCD
mold compound and 8006NS or 8200T die attach
Post Change:
G700LTD
mold compound and 8600 die attach
Impacts
to Data Sheet:
None
Reason
for Change:
To Improve Manufacturability
by qualifying G700LTD mold compound and 8600 die attach at this assembly site.
Change
Implementation Status:
In Progress
Estimated
First Ship Date:
May
24, 2015 (date code: 1521)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings
to Distinguish Revised from Unrevised Devices:
Traceability code
Revision
History:
October
31, 2014: Issued initial
notification.
May
04, 2015: Issued final
notification. Attached the qualification report. Revised the estimated first
ship date from February 28, 2015 to May 24, 2015.
July
20, 2015: Revised PCN to update the devices that will be affected by
this change. Revised the attached affected parts list.
The change described in this P
Please contact your local Microchip sales office with questions or concerns regarding this notification.
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